Vacuum deposition equipment for wafer processes
Achieves a film formation mechanism with excellent film thickness uniformity and high-speed exhaust! Capable of stably forming high-quality electrode films.
The "Vacuum Deposition Device for Wafer Processes" is a batch-type deposition device designed for forming electrode films on wafers up to 6 inches in size. It has a wealth of experience in mass production applications for discrete ICs, compound ICs, and MEMS devices. The device can stably form high-quality electrode films due to its film formation mechanism, which excels in film thickness uniformity, and an oil-free exhaust system that enables rapid evacuation. It boasts a high operational rate as a deposition device for mass production applications. 【Features】 ■ Highly reliable basic configuration ■ Abundant optional mechanisms - Evaporation sources, multi-beam electron guns (10kW), resistance heating evaporation sources, multi-source simultaneous deposition mechanisms - High-temperature heating (up to 550°C) = three-sided planetary dome - Substrate cleaning, ion guns, RF bombardment mechanisms - Substrate dome, three-sided planetary dome, revolution dome, high-temperature heating revolution dome *For more details, please refer to the PDF materials or feel free to contact us.
- Company：神港精機 東京支店
- Price：Other
